Dimensity 8050
MediaTek · 2023
| Process node | 6nm |
| CPU | 1x Cortex-A78 @ 3.0 GHz + 3x Cortex-A78 @ 2.6 GHz + 4x Cortex-A55 @ 2.0 GHz |
| Max. frequency | 3.0 GHz |
| GPU | Mali-G77 MC9 |
The Dimensity 8050 is a entry-level phone chipset from MediaTek (2023) with a MobileRank rating of 9/100. Built on a 6nm process node — efficiency is weak (25/100). It scores 1,029,484 points in AnTuTu (weak tier, 9/100). Geekbench 6: 1186 (single) / 3203 (multi) — single-core performance is weak, multi-core is weak. CPU configuration: 1x Cortex-A78 @ 3.0 GHz + 3x Cortex-A78 @ 2.6 GHz + 4x Cortex-A55 @ 2.0 GHz. The graphics accelerator is the Mali-G77 MC9.
Pros
- Current-generation 2023 chipset
Cons
- Modest overall performance by current SoC standards
- Weak single-core performance
- Outdated 6nm process node
- Limited multi-core performance
Who makes the Dimensity 8050?
The Dimensity 8050 is a chipset from MediaTek, released in 2023. Process node: 6nm.
What is the Dimensity 8050's rating?
MobileRank rating: 9/100. AnTuTu — 9/100, CPU single — 4/100, multi — 4/100.
What GPU does the Dimensity 8050 have?
The Dimensity 8050 features the Mali-G77 MC9 graphics accelerator.
How many points does the Dimensity 8050 score in AnTuTu?
The Dimensity 8050 scores 1,029,484 points in the AnTuTu v10 benchmark.